NDT (Non-Destructive Test)
NDT refers to a series of techniques and processes used to identify the properties, status, internal structure, defects, errors, etc. without destroying the inspection target.
It is applied to various types of manufacturing industries for productivity improvement through the increase of yield rate in manufacturing process and cost reduction as well as quality management.
Ultrasonic testing
It is a representative NDT technique based on the propagation of ultrasonic waves in material tested to analyze the amount of energy and arrival time of reflection from the inside and outside of the product.
It is used to identify the location, size, and alignment of the internal material of the product to find defects or failures.
Specification
| Spec | High Frequency | Mid Frequency | Low Frequency |
|---|---|---|---|
| Transducer Bandwidth | 50 MHz ~ 150 MHz | 1 MHz ~ 55 MHz | ~ 1 MHz |
| Generator Frequency | 80 MHz ~ 120 MHz | 1 MHz ~ MHz | ~ 1 MHz |
| Resolution |
Lateral: 20~50㎛ Depth: 10~20㎛ |
Lateral: 50~100㎛ Depth: 20~40㎛ |
Lateral: over 100㎛ Depth: over 50㎛ |
| DOF | 10 mm | 20 ~ 200 mm | over 200 mm |
| Focal Depth | 2 ~ 8 mm | 10 ~ 400 mm | - |
| Type | Water immersion | Water immersion | Air-coupled |
Features
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01
Tailored services with the self-developed core components
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02
Algorithms and UX that meet customer demand through various field experiences and know-how
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03
Extensible NDT inspection solutions equipped with machine vision
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04
Print out the inspection result in various forms including 2D, 3D images
Process
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Inspection
Ultrasonic testing
01 -
Result analysis
Provide analytic tools selected by customers
02 -
Printing results
Print out the inspection result in various forms including 2D, 3D images
03
PIE provides Tailored NDT solutions to meet customer demand
based on core components developed with its own technologies.
The capability to develop core components by itself determines the quality of NDT solutions.
Based on its technological capabilities and the network of academic and research institutions and industry partners, PIE develops core parts of high-frequency ultrasonic converter.
We guarantee the high quality of tailored NDT solutions as we develop and use parts optimized for the material detected.
PIE offers various types of NDT solutions that meet customer demand based on R&D.
We have developed various ultrasonic techniques including immersion/non-immersion testing Methods through R&D to provide an optimal inspection environment that meets customer demand.
By combining the know-how accumulated through machine vision experience , we have developed an “all-in-one inspection solutions integrated with machine vision,” thereby providing NDT solutions that satisfy customer needs.
Areas of application
- Display
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OLED
(TFE, PI, MN)Panel Defect
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- Semiconductor
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Blank Mask / Wafer
Sub-Micro Inspection
Auto-Review
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- Materials
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PCB, ITO Target / IGZO Target
CAD Inspection
Conversion with
Non Destructive Testing
(Ultra Sonic + Vision + Laser)
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